Multilayer chip electronic component and board having the same

ABSTRACT

A multilayer chip electronic component may include: a ceramic body including a plurality of dielectric layers; an inductor part disposed within the ceramic body and including first and second internal electrodes; a capacitor part disposed within the ceramic body and including third to fifth internal electrodes; and first and second external electrodes disposed on first and second end surfaces of the ceramic body, a third external electrode extended from a second main surface of the ceramic body to first and second side surfaces, and a fourth external electrode extended from a first main surface of the ceramic body to the first and second side surfaces. The capacitor part may be composed of first and second capacitor parts, and the inductor part and the capacitor part may be connected in parallel to each other.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No.10-2014-0039509 filed on Apr. 2, 2014, with the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND

The present disclosure relates to a multilayer chip electronic componentand a board having the same.

In accordance with rapid growth of the market for small portableterminals due to the emergence of smart phones or tablet personalcomputers (PCs), multifunctionalization, miniaturization, and thinningof portable terminals have been further intensified.

Among these, since wireless communications circuits have beenmodularized, they require decreases in volumes thereof, in addition tomultiband correspondence.

Meanwhile, as processing performance of a central processing unit (CPU)of a base band part is improved, wireless modules or radio frequency(RF) analog circuits are driven at high frequency to be subjected toelectromagnetic wave interference from peripheral circuits, such thatcommunications disruption may easily occur.

Meanwhile, an LC filter, a multilayer chip electronic component, ismounted on printed circuit boards of various electronic productsincluding display devices such as liquid crystal displays (LCDs), plasmadisplay panels (PDPs) and the like, computers, smartphones, mobilephones, and the like, to serve as an electronic component forsuppressing noise.

In accordance with the miniaturization of portable terminals, demand forsuch LC filters to be reduced in size while having high efficiency havealso been required.

In addition, along with the rapid development of mobile terminals suchas tablet personal computers (PCs), ultra books, and the like, theminiaturization and high integration of microprocessors have beenconducted.

Therefore, an area of a printed circuit board is decreased andcorrespondingly, a space for mounting the LC filter is limited, suchthat multilayer chip electronic components satisfying the limitedmounting space have been continuously requested.

Further, since portable terminals are being used within higher frequencyranges than ever, LC filters having excellent efficiency in such highfrequency regions are required.

Related Art Document

(Patent Document 1) Japanese Patent Laid-Open Publication No.2012-138415

SUMMARY

An aspect of the present disclosure may provide a multilayer chipelectronic component and a board having the same.

According to an aspect of the present disclosure, a multilayer chipelectronic component may include: a ceramic body including a pluralityof dielectric layers and having first and second main surfaces opposingeach other, first and second side surfaces opposing each other, andfirst and second end surfaces opposing each other; an inductor partdisposed within the ceramic body and including first and second internalelectrodes, the first internal electrode being exposed to the first sidesurface and the first end surface, and the second internal electrodebeing exposed to the second side surface and the second end surface; acapacitor part disposed within the ceramic body and including third tofifth internal electrodes, the third internal electrode being exposed tothe first and second side surfaces, the fourth internal electrode beingexposed to the first end surface, and the fifth internal electrode beingexposed to the second end surface; and first and second externalelectrodes disposed on the first and second end surfaces of the ceramicbody and electrically connected to the first and second internalelectrodes and the fourth and fifth internal electrodes, a thirdexternal electrode extended from the second main surface of the ceramicbody to the first and second side surfaces and connected to the thirdinternal electrode, and a fourth external electrode extended from thefirst main surface of the ceramic body to the first and second sidesurfaces and connected to the first and second internal electrodes,wherein the capacitor part is composed of first and second capacitorparts, and the inductor part and the capacitor part are connected inparallel to each other.

The fourth and fifth internal electrodes maybe formed on a singledielectric layer to be insulated from each other.

A single fourth internal electrode and a single fifth internal electrodemay be separately formed on the respective dielectric layers.

The first internal electrode may be connected to the fourth internalelectrode through the first external electrode, and the second internalelectrode maybe connected to the fifth internal electrode through thesecond external electrode, such that the inductor part and the capacitorpart may be connected to each other.

In the inductor part, a signal input to the first external electrode maypass through the first internal electrode, the fourth externalelectrode, and the second internal electrode sequentially, and be outputto the second external electrode.

In the inductor part, when an interval between the second internalelectrode disposed in an outermost position of the ceramic body in athickness direction and the first main surface of the ceramic body isdefined as t1, and an interval between the first and second internalelectrodes is defined as t2, t1 and t2 may satisfy t1≧0.03 mm andt2≧0.03 mm.

When an interval between the inductor part and the capacitor part isdefined as t3, t3 may satisfy t3≧0.2 mm.

According to another aspect of the present disclosure, a multilayer chipelectronic component may include: a ceramic body including a pluralityof dielectric layers and having first and second main surfaces opposingeach other, first and second side surfaces opposing each other, andfirst and second end surfaces opposing each other; an inductor partdisposed within the ceramic body and including first and second internalelectrodes formed on a single dielectric layer to be insulated from eachother, the first internal electrode being exposed to the first endsurface and the first side surface and the second internal electrodebeing exposed to the second end surface and the second side surface; acapacitor part disposed within the ceramic body and including a thirdinternal electrode exposed to the first and second side surfaces, afourth internal electrode exposed to the first end surface, and a fifthinternal electrode exposed to the second end surface, the fourth andfifth internal electrodes being formed on a single dielectric layer tobe insulated from each other; and first and second external electrodesdisposed on the first and second end surfaces of the ceramic body andelectrically connected to the first and second internal electrodes andthe fourth and fifth internal electrodes, a third external electrodeextended from the second main surface of the ceramic body to the firstand second side surfaces and connected to the third internal electrode,and a fourth external electrode extended from the first main surface ofthe ceramic body to the first and second side surfaces and connected tothe first and second internal electrodes, wherein the capacitor part iscomposed of first and second capacitor parts, and the inductor part andthe capacitor part are connected in parallel to each other.

The first internal electrode may be connected to the fourth internalelectrode through the first external electrode, and the second internalelectrode maybe connected to the fifth internal electrode through thesecond external electrode, such that the inductor part and the capacitorpart may be connected to each other.

In the inductor part, a signal input to the first external electrode maypass through the first internal electrode, the fourth externalelectrode, and the second internal electrode sequentially, and be outputto the second external electrode.

When an interval between the inductor part and the capacitor part isdefined as t3, t3 may satisfy t3≧0.2 mm.

According to another aspect of the present disclosure, a board having amultilayer chip electronic component may include: a printed circuitboard having first to third electrode pads formed thereon; and themultilayer chip electronic component as described above mounted on theprinted circuit board.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a perspective view of a multilayer chip electronic componentaccording to an exemplary embodiment of the present disclosure;

FIG. 2 is plan views illustrating first and second internal electrodesusable in the multilayer chip electronic component shown in FIG. 1;

FIG. 3 is plan views illustrating third to fifth internal electrodesusable together with the first and second internal electrodes shown inFIG. 2;

FIG. 4 is a perspective view schematically illustrating a signal flowpath of an inductor part and an interior of the multilayer chipelectronic component according to an exemplary embodiment of the presentdisclosure;

FIG. 5 is a cross-sectional view taken along line A-A′ of FIG. 1;

FIG. 6 is an equivalent circuit diagram of the multilayer chipelectronic component shown in FIG. 1;

FIG. 7 is a perspective view of a multilayer chip electronic componentaccording to another exemplary embodiment of the present disclosure;

FIG. 8 is a plan view illustrating first and second internal electrodesusable in the multilayer chip electronic component shown in FIG. 7;

FIG. 9 is plan views illustrating third to fifth internal electrodesusable together with the first and second internal electrodes shown inFIG. 8;

FIG. 10 is a perspective view of a multilayer chip electronic componentaccording to another exemplary embodiment of the present disclosure;

FIG. 11 is a plan view illustrating first and second internal electrodesusable in the multilayer chip electronic component shown in FIG. 10;

FIG. 12 is a plan view illustrating third to fifth internal electrodesusable together with the first and second internal electrodes shown inFIG. 11; and

FIG. 13 is a perspective view illustrating a state in which themultilayer chip electronic component of FIG. 1 is mounted on a printedcircuit board.

DETAILED DESCRIPTION

Exemplary embodiments of the present disclosure will now be described indetail with reference to the accompanying drawings.

The disclosure may, however, be exemplified in many different forms andshould not be construed as being limited to the specific embodiments setforth herein.

Rather, these embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the scope of the disclosureto those skilled in the art.

In the drawings, the shapes and dimensions of elements maybe exaggeratedfor clarity, and the same reference numerals will be used throughout todesignate the same or like elements.

Directions of a hexahedron will be defined in order to clearly describeexemplary embodiments of the present disclosure. L, W and T shown in theaccompanying drawings refer to a length direction, a width direction,and a thickness direction, respectively. Here, the thickness directionmaybe used to have the same concept as a stacking direction in whichdielectric layers are stacked.

Multilayer Chip Electronic Component

FIG. 1 is a perspective view of a multilayer chip electronic componentaccording to an exemplary embodiment of the present disclosure.

FIG. 2 is a plan view illustrating first and second internal electrodesusable in the multilayer chip electronic component shown in FIG. 1.

FIG. 3 is a plan view illustrating third to fifth internal electrodesusable together with the first and second internal electrodes shown inFIG. 2.

FIG. 4 is a perspective view schematically illustrating a signal flowpath of an inductor part and an interior of the multilayer chipelectronic component according to an exemplary embodiment of the presentdisclosure.

FIG. 5 is a cross-sectional view taken along line A-A′ of FIG. 1.

Referring to FIGS. 1 through 5, a multilayer chip electronic component100 according to an exemplary embodiment of the present disclosure mayinclude a ceramic body 110 including a plurality of dielectric layers111 and having first and second main surfaces opposing each other, firstand second side surfaces opposing each other, and first and second endsurfaces opposing each other.

In the exemplary embodiment, the ceramic body 110 may have first andsecond main surfaces 5 and 6 opposing each other, and first and secondside surfaces 3 and 4 and first and second end surfaces 1 and 2 thatconnect the first and second main surfaces to each other.

A shape of the ceramic body 110 is not particularly limited, but may bea hexahedral shape as shown in the exemplary embodiment.

The ceramic body 110 may be formed by stacking the plurality ofdielectric layers, and a plurality of internal electrodes are disposedseparately from one another in the ceramic body 110, each of thedielectric layers being interposed between the internal electrodes.

The plurality of dielectric layers 111 configuring the ceramic body 110may be in a sintered state, and adjacent dielectric layers areintegrated with each other so that a boundary therebetween may not bediscernible.

The dielectric layers 111 may be formed by sintering ceramic greensheets containing a ceramic powder, an organic solvent, and an organicbinder. The ceramic powder may have a high k-material and examplesthereof may include a barium titanate (BaTiO₃) based material, astrontium titanate (SrTiO₃) based material, and the like. However, theceramic powder is not limited thereto.

Meanwhile, as described below, dielectric layers forming a capacitorpart C maybe formed using the ceramic powder, and dielectric layersforming an inductor part L may be formed using a Ni—Cu—Zn based ferritematerial, a Ni—Cu—Zn—Mg based ferrite material, or a Mn—Zn based ferritematerial, but the present disclosure is not limited thereto.

The multilayer chip electronic component 100 may include the inductorpart L formed within the ceramic body 110 and including first and secondinternal electrodes 121 and 122, the first internal electrode 121 beingexposed to the first side surface 3 and the first end surface 1, and thesecond internal electrode 122 being exposed to the second side surface 4and the second end surface 2.

According to an exemplary embodiment of the present disclosure, thefirst and second internal electrodes 121 and 122 may be formed of aconductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), oran alloy thereof, but is not limited thereto.

The internal electrodes may be printed on the ceramic green sheetsforming the dielectric layers using the conductive paste by a printingmethod such as a screen printing method or a gravure printing method.

The ceramic green sheets on which the internal electrodes are printedmay be alternately stacked and sintered, thereby forming the ceramicbody.

In addition, the multilayer chip electronic component 100 may includethe capacitor part C formed within the ceramic body 110 and includingthird to fifth internal electrodes 123 to 125, the third internalelectrode 123 being exposed to the first and second side surfaces 3 and4, the fourth internal electrode 124 being exposed to the first endsurface 1, and the fifth internal electrode 125 being exposed to thesecond end surface 2.

The capacitor part C may be formed by the third internal electrode 123and the fourth and fifth internal electrodes 124 and 125, and the fourthand fifth internal electrodes 124 and 125 insulated from each other on asingle dielectric layer 111 and the third internal electrode 123 mayconfigure first and second capacitor parts C1 and C2, respectively, andmay be connected to each other in parallel.

The third to fifth internal electrodes 123 to 125 are not particularlylimited but may be formed using, for example, a conductive pastecontaining a conductive metal, similarly to the first and secondinternal electrodes 121 and 122.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), oran alloy thereof, but is not limited thereto.

In addition, the multilayer chip electronic component 100 may includefirst and second external electrodes 131 and 132 formed on the first andsecond end surfaces 1 and 2 of the ceramic body 110 and electricallyconnected to the first and second internal electrodes 121 and 122 andthe fourth and fifth internal electrodes 124 and 125, a third externalelectrode 133 extended from the second main surface 6 of the ceramicbody 110 to the first and second side surfaces 3 and 4 and connected tothe third internal electrode 123, and a fourth external electrode 134extended from the first main surface 5 of the ceramic body 110 to thefirst and second side surfaces 3 and 4 and connected to the first andsecond internal electrodes 121 and 122.

According to an exemplary embodiment of the present disclosure, amounting surface of the multilayer chip electronic component 100 may bethe second main surface 6 of the ceramic body 110.

As described above, since the multilayer chip electronic componentaccording to an exemplary embodiment of the present disclosure ismounted to be horizontal in relation to a board and the mounting surfacethereof is the second main surface 6 of the ceramic body 110, althoughnot shown in the drawings, a marking portion having a different colorcapable of being visibly distinguished may be further formed on oneoutermost dielectric layer in order to determine a mounting direction.

Therefore, the external electrodes contacting first to third electrodepads on a board on which the multilayer chip electronic component ismounted, to be described below, maybe the first to third externalelectrodes 131 to 133.

In this case, the first external electrode 131 may function as a signalinput terminal, the second external electrode 132 may function as asignal output terminal, and the third external electrode 133 mayfunction as a ground terminal or an earth terminal.

According to an exemplary embodiment of the present disclosure, it maybe understood that the remaining single external electrode 134 exceptfor the first and second external electrodes 131 and 132 used asexternal terminals for connection with a power line and the thirdexternal electrode 133 used as the ground terminal may be used as aconnection terminal for forming the inductor part L.

Therefore, the fourth external electrode 134 which is usable as theconnection terminal for forming the inductor part L, may be anon-contact terminal in a state of non-contact with the power line asdescribed above, and may be positioned on an upper surface of themultilayer chip electronic component when the multilayer chip electroniccomponent is mounted on a board.

The first to fourth external electrodes 131 to 134 may be formed of aconductive paste including a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), tin (Sn), or analloy thereof, but is not limited thereto.

The conductive paste may further contain an insulating material. Theinsulating material may be, for example, glass, but is not limitedthereto.

A method of forming the first to fourth external electrodes 131 to 134is not particularly limited. That is, the first to fourth externalelectrodes 131 to 134 may be formed on the ceramic body by a printingmethod, a dipping method, or another method such as a plating method, orthe like.

Subsequently, a plating layer may be further formed on the first tofourth external electrodes 131 to 134.

The multilayer chip electronic component 100 may be a 3-terminal LCfilter having a total of four external electrodes and three contactterminals, but the present disclosure is not limited thereto.

Hereinafter, among the components of the multilayer chip electroniccomponent 100 according to an exemplary embodiment of the presentdisclosure, the first to fifth internal electrodes 121 to 125 and thefirst to fourth external electrodes 131 to 134 will be described indetail with reference to FIGS. 2 through 5.

Referring to FIG. 2, the inductor part L may be formed within theceramic body 110 and include the first and second internal electrodes121 and 122, the first internal electrode 121 being exposed to the firstside surface 3 and the first end surface 1, and the second internalelectrode 122 being exposed to the second side surface 4 and the secondend surface 2 to thereby form inductance.

The first internal electrode 121 may be connected to the first andfourth external electrodes 131 and 134, and the second internalelectrode 122 may be connected to the second and fourth externalelectrodes 132 and 134.

That is, a signal input to the first external electrode 131 used as thesignal input terminal may pass through the first and second internalelectrodes 121 and 122 via the fourth external electrode 134 provided asthe connection terminal to thereby be output through the second externalelectrode 132 used as the signal output terminal, in a state in whichnoise of the signal is removed.

Referring to FIG. 3, the capacitor part C may be formed within theceramic body 110 and include the third to fifth internal electrodes 123to 125, the third internal electrode 123 being exposed to the first andsecond side surfaces 3 and 4, the fourth internal electrode 124 beingexposed to the first end surface 1, and the fifth internal electrode 125being exposed to the second end surface 2 to thereby form capacitance.

Particularly, in the capacitor part C, the fourth and fifth internalelectrodes 124 and 125 insulated from each other on a single dielectriclayer 111 and the third internal electrode 123 may configure the firstand second capacitor parts C1 and C2, respectively, and be connected inparallel to each other.

The third internal electrode 123 may be disposed toward the second mainsurface 6, which is the mounting surface of the ceramic body, that is,in a lower portion of the ceramic body 110 in the thickness direction tothereby be connected to the third external electrode 133. The fourth andfifth internal electrodes 124 and 125 may also be disposed in the lowerportion of the ceramic body 110 in the thickness direction and connectedto the first and second external electrodes 131 and 132.

The first internal electrode 121 is connected to the fourth internalelectrode 124 through the first external electrode 131, and the secondinternal electrode 122 is connected to the fifth internal electrode 125through the second external electrode 132, such that the inductor part Land the capacitor part C may be connected in parallel to each other.

The capacitor part C may be disposed in the ceramic body 110 withoutparticular limitations, and in order to implement a target capacitance,a plurality of capacitor parts may be stacked.

The order of stacking the first to fifth internal electrodes 121 to 125is not particularly limited.

For example, as shown in FIGS. 4 and 5, the first and second internalelectrodes 121 and 122 configuring the inductor part L may be disposedin an upper portion of the ceramic body 110 in the thickness direction,and the third to fifth internal electrodes 123 to 125 configuring thecapacitor part may be disposed toward the second main surface 6, whichis the mounting surface of the ceramic body, that is, in the lowerportion of the ceramic body 110 in the thickness direction.

In addition, although each of the first to fifth internal electrodes 121to 125 shown in FIGS. 2 and 3 is provided in a singular number,actually, each of the first to fifth internal electrodes 121 to 125 maybe provided in plural numbers.

Pattern shapes of the first to fifth internal electrodes 121 to 125shown in FIGS. 2 and 3 are provided by way of example according to anexemplary embodiment of the present disclosure, and the first to fifthinternal electrodes 121 to 125 may have various pattern shapes in orderto control inductance and capacitance.

Referring to FIG. 4, in the inductor part L, the signal input to thefirst external electrode 131 may pass through the first internalelectrode 121, the fourth external electrode 134, and the secondinternal electrode 122 sequentially to be output to the second externalelectrode 132, such that the inductor part L may have a shape of asingle turn coil.

That is, in the multilayer chip electronic component according to anexemplary embodiment of the present disclosure, since the inductor partL is configured without a through-hole electrode, a manufacturing costmay be decreased.

In addition, since the through-hole electrode is not used, defectiveconnection between the through-hole electrode and the internalelectrodes may not occur, and a manufacturing yield may not bedecreased.

Further, since the fourth external electrode 134 is used as a signalline as described above, heat generated due to loss in the internalelectrodes may be discharged to the outside, such that high allowablecurrent may be set.

Referring to FIG. 5, in the inductor part L, when an interval betweenthe second internal electrode 122 disposed in an outermost position ofthe ceramic body in the thickness direction and the first main surface 5of the ceramic body 110 is defined as t1, and an interval between thefirst and second internal electrodes 121 and 122 is defined as t2, t1and t2 may satisfy t1≧0.03 mm and t2≧0.03 mm.

Inductance of the inductor part L may be increased by adjusting t1 andt2 so as to satisfy t1≧0.03 mm and t2≧0.03 mm.

In a case in which t1 and t2 are less than 0.03 mm, an effect ofimproving inductance of the inductor part L may be insignificant.

Meanwhile, when an interval between the inductor part L and thecapacitor part C is defined as t3, t3 may satisfy t3≧0.2 mm.

The interval t3 between the inductor part L and the capacitor part C isadjusted to satisfy t3≧0.2 mm, such that the occurrence of straycapacitance or inductance may be blocked, thereby improving noisereduction characteristics in a high frequency region.

In a case in which the interval t3 between the inductor part L and thecapacitor part C is less than 0.2 mm, stay capacitance or inductancemaybe generated between the inductor part L and the capacitor part C,such that noise reduction characteristics in a high frequency regionmaybe deteriorated.

FIG. 6 is an equivalent circuit diagram of the multilayer chipelectronic component shown in FIG. 1.

Referring to FIG. 6, the first capacitor part C1 including the third andfourth internal electrodes 123 and 124 and the second capacitor part C2including the third and fifth internal electrodes 123 and 125 may beconnected in parallel to the inductor part L including the first andsecond internal electrodes 121 and 122.

As described above, the multilayer chip electronic component accordingto an exemplary embodiment of the present disclosure may have a singletype of inductor and two types of capacitors and control respectivevalues thereof.

The multilayer chip electronic component according to an exemplaryembodiment of the present disclosure has the above-mentioned structure,such that the multilayer chip electronic component according to thepresent disclosure may have high noise removal efficiency in highfrequency regions as compared to a structure according to the relatedart, and amounting space and a cost required therefor may be decreaseddue to a decrease in the number of required components.

In addition, in the multilayer chip electronic component according to anexemplary embodiment of the present disclosure, since the inductor partL is configured without the through-hole electrode, a manufacturing costmay be decreased.

In addition, since the through-hole electrode is not used, defectiveconnection between the through-hole electrode and the internal electrodemay not occur, and a manufacturing yield may not be decreased.

Further, since the fourth external electrode 134 is used as a signalline as described above, heat generated due to loss in the internalelectrodes may be discharged to the outside, such that high allowablecurrent may be set.

FIG. 7 is a perspective view of a multilayer chip electronic componentaccording to another exemplary embodiment of the present disclosure.

FIG. 8 is a plan view illustrating first and second internal electrodesusable in the multilayer chip electronic component shown in FIG. 7.

FIG. 9 is a plan view illustrating third to fifth internal electrodesusable together with the first and second internal electrodes shown inFIG. 8.

Referring to FIGS. 7 through 9, a multilayer chip electronic component200 according to another exemplary embodiment of the present disclosuremay include a ceramic body 210 including a plurality of dielectriclayers 211 and having first and second main surfaces 5 and 6 opposingeach other, first and second side surfaces 3 and 4 opposing each other,and first and second end surfaces 1 and 2 opposing each other; aninductor part formed within the ceramic body 210 and including first andsecond internal electrodes 221 and 222, the first internal electrode 221being exposed to the first side surface 3 and the first end surface 1and the second internal electrode 222 being exposed to the second sidesurface 4 and the second end surface 2; a capacitor part formed withinthe ceramic body 210 and including third to fifth internal electrodes223 to 225, the third internal electrode 223 being exposed to the firstand second side surfaces 3 and 4, the fourth internal electrode 224being exposed to the first end surface 1, and the fifth internalelectrode 225 being exposed to the second end surface 2; and first andsecond external electrodes 231 and 232 formed on the first and secondend surfaces 1 and 2 of the ceramic body 210 and electrically connectedto the first and second internal electrodes 221 and 222 and the fourthand fifth internal electrodes 224 and 225, a third external electrode233 extended from the second main surface 6 of the ceramic body 210 tothe first and second side surfaces 3 and 4 and connected to the thirdinternal electrode 223, and a fourth external electrode 234 extendedfrom the first main surface 5 of the ceramic body 210 to the first andsecond side surfaces 3 and 4 and connected to the first and secondinternal electrodes 221 and 222, wherein the capacitor part is composedof first and second capacitor parts, and the inductor part and thecapacitor part are connected in parallel to each other.

Particularly, in the multilayer chip electronic component 200 accordingto another exemplary embodiment of the present disclosure, a singlefourth internal electrode 224 and a single fifth internal electrode 225may be separately formed on the respective dielectric layers.

Since other features of the multilayer chip electronic component 200according to another exemplary embodiment of the present disclosure area single as those of the above-mentioned multilayer chip electroniccomponent 100 according to an exemplary embodiment of the presentdisclosure, a detailed description thereof will be omitted.

FIG. 10 is a perspective view of a multilayer chip electronic componentaccording to another exemplary embodiment of the present disclosure.

FIG. 11 is a plan view illustrating first and second internal electrodesusable in the multilayer chip electronic component shown in FIG. 10.

FIG. 12 is a plan view illustrating third to fifth internal electrodesusable together with the first and second internal electrodes shown inFIG. 11.

Referring to FIGS. 10 through 12, a multilayer chip electronic component300 according to another exemplary embodiment of the present disclosuremay include a ceramic body 310 including a plurality of dielectriclayers 311 and having first and second main surfaces 5 and 6 opposingeach other, first and second side surfaces 3 and 4 opposing each other,and first and second end surfaces 1 and 2 opposing each other; aninductor part formed within the ceramic body 310 and including first andsecond internal electrodes 321 and 322 formed on a single dielectriclayer 311 to be insulated from each other, the first internal electrode321 being exposed to the first end surface 1 and the first side surface3 and the second internal electrode 322 being exposed to the second endsurface 2 and the second side surface 4; a capacitor part formed withinthe ceramic body 310 and including a third internal electrode 323exposed to the first and second side surfaces 3 and 4, a fourth internalelectrode 324 exposed to the first end surface 1, and a fifth internalelectrode 325 exposed to the second end surface 2, the fourth and fifthinternal electrodes being formed on a single dielectric layers 311 to beinsulated from each other; and first and second external electrodes 331and 332 formed on the first and second end surfaces 1 and 2 of theceramic body 310 and electrically connected to the first and secondinternal electrodes 321 and 322 and the fourth and fifth internalelectrodes 324 and 325, a third external electrode 333 extended from thesecond main surface 6 of the ceramic body 310 to the first and secondside surfaces 3 and 4 and connected to the third internal electrode 323,and a fourth external electrode 334 extended from the first main surface5 of the ceramic body 310 to the first and second side surfaces 3 and 4and connected to the first and second internal electrodes 321 and 322,wherein the capacitor part is composed of first and second capacitorparts, and the inductor part and the capacitor part are connected inparallel to each other.

The first internal electrode 321 is connected to the fourth internalelectrode 324 through the first external electrode 331, and the secondinternal electrode 322 is connected to the fifth internal electrode 325through the second external electrode 332, such that the inductor partand the capacitor part may be connected to each other.

In the inductor part, a signal input to the first external electrode 331may pass through the first internal electrode 321, the fourth externalelectrode 334, and the second internal electrode 322 sequentially tothereby be output to the second external electrode 332.

When an interval between the inductor part and the capacitor part isdefined as t3, t3 may satisfy t3≧0.2 mm.

Since other features of the multilayer chip electronic component 300according to another exemplary embodiment of the present disclosure arethe same as those of the above-mentioned multilayer chip electroniccomponent 100 according to an exemplary embodiment of the presentdisclosure, a detailed description thereof will be omitted.

Board Having Multilayer Chip Electronic Component

FIG. 13 is a perspective view illustrating a state in which themultilayer chip electronic component of FIG. 1 is mounted on a printedcircuit board.

Referring to FIG. 13, a board 400 having the multilayer chip electroniccomponent 100 according to the exemplary embodiment may include aprinted circuit board (PCB) 410 on which the internal electrodes of themultilayer chip electronic component 100 are mounted to be horizontal inrelation to the PCB and first to third electrode pads 421 to 423 formedon the printed circuit board 410 to be spaced apart from one another.

In this case, the multilayer chip electronic component 100 may beelectrically connected to the printed circuit board 410 by solder 430 ina state in which the first to third external electrodes 131 to 133 arepositioned on the first to third electrode pads 421 to 423 to come intocontact therewith.

Except for the above-mentioned description, a description of featuresoverlapped with those of the multilayer chip electronic componentaccording to an exemplary embodiment of the present disclosure describedas above will be omitted.

As set forth above, according to exemplary embodiments of the presentdisclosure, the multilayer chip electronic component may include theinductor part and the capacitor part and control respective values ofthe inductor part and the capacitor part.

Therefore, the multilayer chip electronic component according toexemplary embodiments of the present disclosure may have high noiseremoval efficiency in high frequency regions as compared to a structureaccording to the related art, and a mounting space and costs may bedecreased due to a decrease in the number of required components.

In addition, in the multilayer chip electronic component according toexemplary embodiments of the present disclosure, since an inductor partis configured without a through-hole electrode, manufacturing costs maybe decreased.

In addition, since the through-hole electrode is not used, defectiveconnection between the through-hole electrode and the internal electrodemay not occur, and a manufacturing yield may not be decreased.

Further, since an external electrode in a state of non-contact withaboard is used as a signal line, heat generated due to loss in theinternal electrode may be discharged to the outside, such that highallowable current may be set.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the spirit and scope ofthe present disclosure as defined by the appended claims.

What is claimed is:
 1. A multilayer chip electronic componentcomprising: a ceramic body including a plurality of dielectric layersand having first and second main surfaces opposing each other, first andsecond side surfaces opposing each other, and first and second endsurfaces opposing each other; an inductor part disposed within theceramic body and including first and second internal electrodes, thefirst internal electrode being exposed to the first side surface and thefirst end surface, and the second internal electrode being exposed tothe second side surface and the second end surface; a capacitor partdisposed within the ceramic body and including third to fifth internalelectrodes, the third internal electrode being exposed to the first andsecond side surfaces, the fourth internal electrode being exposed to thefirst end surface, and the fifth internal electrode being exposed to thesecond end surface; and first and second external electrodes disposed onthe first and second end surfaces of the ceramic body and electricallyconnected to the first and second internal electrodes and the fourth andfifth internal electrodes, a third external electrode extended from thesecond main surface of the ceramic body to the first and second sidesurfaces and connected to the third internal electrode, and a fourthexternal electrode extended from the first main surface of the ceramicbody to the first and second side surfaces and connected to the firstand second internal electrodes, wherein the capacitor part is composedof first and second capacitor parts, and the inductor part and thecapacitor part are connected in parallel to each other.
 2. Themultilayer chip electronic component of claim 1, wherein the fourth andfifth internal electrodes are formed on a single dielectric layer to beinsulated from each other.
 3. The multilayer chip electronic componentof claim 1, wherein a single fourth internal electrode and a singlefifth internal electrode are separately formed on the respectivedielectric layers.
 4. The multilayer chip electronic component of claim1, wherein the first internal electrode is connected to the fourthinternal electrode through the first external electrode, and the secondinternal electrode is connected to the fifth internal electrode throughthe second external electrode, such that the inductor part and thecapacitor part are connected to each other.
 5. The multilayer chipelectronic component of claim 1, wherein in the inductor part, a signalinput to the first external electrode passes through the first internalelectrode, the fourth external electrode, and the second internalelectrode sequentially, and is output to the second external electrode.6. The multilayer chip electronic component of claim 1, wherein in theinductor part, when an interval between the second internal electrodedisposed in an outermost position of the ceramic body in a thicknessdirection and the first main surface of the ceramic body is defined ast1, and an interval between the first and second internal electrodes isdefined as t2, t1 and t2 satisfy t1≧0.03 mm and t2≧0.03 mm.
 7. Themultilayer chip electronic component of claim 1, wherein when aninterval between the inductor part and the capacitor part is defined ast3, t3 satisfies t3≧0.2 mm.
 8. A multilayer chip electronic componentcomprising: a ceramic body including a plurality of dielectric layersand having first and second main surfaces opposing each other, first andsecond side surfaces opposing each other, and first and second endsurfaces opposing each other; an inductor part disposed within theceramic body and including first and second internal electrodes formedon a single dielectric layer to be insulated from each other, the firstinternal electrode being exposed to the first end surface and the firstside surface and the second internal electrode being exposed to thesecond end surface and the second side surface; a capacitor partdisposed within the ceramic body and including a third internalelectrode exposed to the first and second side surfaces, a fourthinternal electrode exposed to the first end surface, and a fifthinternal electrode exposed to the second end surface, the fourth andfifth internal electrodes being formed on a single dielectric layer tobe insulated from each other; and first and second external electrodesdisposed on the first and second end surfaces of the ceramic body andelectrically connected to the first and second internal electrodes andthe fourth and fifth internal electrodes, a third external electrodeextended from the second main surface of the ceramic body to the firstand second side surfaces and connected to the third internal electrode,and a fourth external electrode extended from the first main surface ofthe ceramic body to the first and second side surfaces and connected tothe first and second internal electrodes, wherein the capacitor part iscomposed of first and second capacitor parts, and the inductor part andthe capacitor part are connected in parallel to each other.
 9. Themultilayer chip electronic component of claim 8, wherein the firstinternal electrode is connected to the fourth internal electrode throughthe first external electrode, and the second internal electrode isconnected to the fifth internal electrode through the second externalelectrode, such that the inductor part and the capacitor part areconnected to each other.
 10. The multilayer chip electronic component ofclaim 8, wherein in the inductor part, a signal input to the firstexternal electrode passes through the first internal electrode, thefourth external electrode, and the second internal electrodesequentially, and is output to the second external electrode.
 11. Themultilayer chip electronic component of claim 8, wherein when aninterval between the inductor part and the capacitor part is defined ast3, t3 satisfies t3≧0.2 mm.
 12. A board having a multilayer chipelectronic component comprising: a printed circuit board having first tothird electrode pads formed thereon; and the multilayer chip electroniccomponent of claim 1 mounted on the printed circuit board.
 13. A boardhaving a multilayer chip electronic component comprising: a printedcircuit board having first to third electrode pads formed thereon; andthe multilayer chip electronic component of claim 8 mounted on theprinted circuit board.